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| rev.1.01 feb 23, 2007 page 1 of 13 hkt100***u/hkt100y01u -chip (rfid) rej03p0006-0101 rev.1.01 feb 23, 2007 overview ? hkt100***u/hkt 100y01u is rfid (radio frequency identification) for 2.45 ghz. ? it has a unique id inside, then it is applicable for management of individual object. note: "***" or "y01" is a rom code. feature ? thin and small package: urp (ptsp0002za-a) ? including unique -chip id which is not alterable ? communication without contact note: " -chip" and the -chip logo are either registered trademarks or trademarks of hitachi,ltd. in japan and in other countries.
hkt100***u/hkt100y01u rev.1.01 feb 23, 2007 page 2 of 13 order part no. order part no. unit of packaging packing form unit of order note hkt100***u 3,000 taping 75,000 hkt100y01u 3,000 taping 3,000 outline and mark mark rom code is indicated. hkt100***u/hkt100y01u rev.1.01 feb 23, 2007 page 3 of 13 absolute maximum ratings specification item symbol min typ max unit condition remark storage temperature tstg ?30 ?- 75 c ambient operation temperature ta 0 25 40 c no condensation received power pr ? ? 13.8 dbm electrical characteristics measurement conditions: unless otherwise specified, ta = 25 c, fc = 2.416 0.010 ghz, reader power = 150 mw single-patch antenna, linearity polarized waves, clock cycle =10 s, clock duty cycle = 85% period of reading operations: 8 clock cycles, number of read bits: 128 bits product is measured under the condition that it is pressed onto the antenna shown in figure 1. please refer the preceding sheet. specification item min typ max unit condition remark communication distance 6.5 ? 13 cm note4 note1 -chip id check ? passed ? ? edc check note2, note3 notes: 1. the distance at which the read -chip id value matches the indicated value and the edc check is passed. 2. verification value calculated from the read -chip id value. 3. detail data of -chip id is describe on the commodity specification. 4. relation between the evaluation antenna and antenna positions; the planes of the gilded pattern for the evaluation antenna and the antenna itself should be parallel, the center of the evaluation antenna should be on the line t hat passes through the center of the antenna plane, and the gilded pattern?s longer side should be within the antenna?s plane of polarization. 5 29 29 100 1 5 5 2 3 10 1 w = 0.5 3 4 3 4 glass epoxy thickness 1.5 mm gilding 5 figure 1 evaluation antenna hkt100***u/hkt100y01u rev.1.01 feb 23, 2007 page 4 of 13 reader specifications and type no.: mr-std2 item symbol specification unit remarks operation temperature ta 25 c carrier frequency fc 2.416 0.010 ghz power pw 150 mw clock cycle tclk 10 s clock duty ratio duty 85 % data read cycle tfm 8 clock data read bit count nb 128 bits cable specifications item symbol specification unit remarks cable material ? semi-rigid ? total length of cable l 20 cm antenna specifications and type no.: pa1-2450as item symbol specification unit remarks operation temperature ta 25 c polarization ? linear ? number of patches ? 1 pcs gain ? 7 dbi hkt100***u/hkt100y01u rev.1.01 feb 23, 2007 page 5 of 13 dimension of inlet outline unit: mm note: cathode mark indicates gnd side. 0 to 0.10 1.7 0.15 2.5 0.15 0.3 0.15 1.25 0.15 cathode mark type no. 0.9 0.15 hkt100***u/hkt100y01u rev.1.01 feb 23, 2007 page 6 of 13 packing specifications taping specification 1. direction of device device carrier tape cathode mark unreeling direction 2. taping dimensions a. carrier tape and cover tape 4.0 0.1 (5.6) 4.0 0.1 2.0 0.08 1.75 0.1 8.0 0.2 + 0.1 ? 0.0 3.5 0.1 (2.9) device (1.5) cover tape (t 0.065) carrier tape ( ): reference only. note: there are two kind of carrier tape thickness used. *0.20 0.05 0.25 0.05 1.5 ( 1.1) unit: mm b. leader and trailer 100 to 200 trailer device 100 to 350 carrier tape 200 to 1000 cover tape leader unit: mm hkt100***u/hkt100y01u rev.1.01 feb 23, 2007 page 7 of 13 c. reel dimensions label 21.0 0.8 2.0 0.5 10.0 1.5 2.0 + 0.5 ? 1.0 178 2 13.0 0.5 unit: mm d. example of labeling p/n: int.c: hzu2.0btrf-e w/c:3d4 lot: ec40020-0h qty:3000 japan pb-free t. renesas (1) (2) (3) (5) (4) (for adapted lead free) notes: 1. part no. 2. management no. (year, month and weekly code) 3. quantity 4. lot no. 5. country of origin japan japan malaysia malaysia hkt100***u/hkt100y01u rev.1.01 feb 23, 2007 page 8 of 13 3. specifications item rated value breaking force (f) of cover tape breaking force (f) = 0.10 to 0.69 n (10 to 70 g) peeling angle = 0 to 10 cover tape hkt100***u/hkt100y01u rev.1.01 feb 23, 2007 page 9 of 13 inner packing box (185) (16) (77) (16) 1 reel 2 6 reels (185) label label label or (185) (185) (185) (185) ( ): reference only. unit: mm example of labeling (1) pack-id (2) device name note: indicate "q" the end of a device name only in the case of direct sale in malaysia (3) quantity (4) sap name (5) country of wafer process (6) country of assembly japan made in japan malaysia made in malaysia (7) trace code (8) lot code (9) pb-free indication (only for pb-free product) (10) date of label issuance (1) (2) (3) (5) (6) (4) (7) wp made in japan as made in japan t/c 6c2 fl90030e0 s.lot fl90030e0 pb-free t. 2006/03/06 pid 06100p10cv-001 d/n rkz6.8tkjr1 spn rkz6.8tkjr1 zzzz qty 8000 (10) (9) (8) hkt100***u/hkt100y01u rev.1.01 feb 23, 2007 page 10 of 13 appearance there should not be any scratch or/and dirt that affect characteristics. quality level (compliant with the jis z 9015) electrical characteristics: aql = 4.0% appearance: aql = 4.0% precautions on usage 1. renesas technology does not guarantee the product characteristics after it has been through assembly on the customer side. 2. please refer to the mounting manual. (document no.: rej11p0006-0101) 3. as for this product, the electrostatic destruction pr evention measures are not done because of the communication characteristic priority. therefore, th e electrostatic destruction voltage is about 50 v in machine model (eiaj), and the static electricity level management in the process until a metallic antenna connecting is especially necessary. system outline -chip inlet reader antenna supply voltage / modulator clock demodulator -chip logic circuit 128-bit rom reset circuit function blocks block name description of functions supply voltage/modulator generates power-supply voltage from carrier signals, varies the output impedance of the modulator circuit to match the input impedance of the antenna, and handles communications. the ic incorporates a power lim iter for the protection of internal devices. reset circuit determines whether or not a clock si gnal is being supplied and cancels the reset mode in synchronization with the first clock cycle. clock demodulator demodulates the clock signal from the envelope signal of the received signal. logic circuit the ic includes an on-chip 128-bit rom from which data signals are sent out in synchronization with the clock signal. hkt100***u/hkt100y01u rev.1.01 feb 23, 2007 page 11 of 13 precautions for storage, transportation and measuring note: these notes indicate a general item. please give priority to the notatio n in each c.s with various kinds of notes originating in a product. 1. other precaution involve problems occurring during storage, transportation and measurement. although the general precautions for storag e and transportation of electronic compon ents can be applie d as they are to semiconductor devices, the latter require certain special precautions in addition to these. the following account includes the general precautions. 1.1 storage of semiconductor devices the following methods of storage are advisable for semiconduc tor devices. if the precautions are not observed, faults in electrical characteristics, solderability, external appearance and other attributes may occur. in some cases, failure may also result. precautions for storage are as follows, (1) the storage location should be kept within the optimum ranges of temperature and humidity: 5 to 35 c and 45 to 75% r.h. are the optimal conditions. (2) the atmosphere in the storage location should not contai n any noxious gases, and the amount of dust should be minimal. (3) storage containers should not be susceptible to static electricity. (4) semiconductor devices should not be subjected to loads. (5) when strong for long periods, store in the non-processed st ate. when leads have already been formed, corrosion at their bent portion of leads may occur. (6) be sure that sudden temperature changes sufficient to cause condensation do not occur during storage of the devices. 1.2 precautions for transportation when transporting semiconductor devices or their assembly units or subsystems, the same precautions as for other electronic components should be taken. the items listed in 1.1 and 1.2 have to be followed. (1) transportation containers, jigs etc., should not pi ck up static charge due to vibration en route. (2) persons handling semiconductor devices should be grounded via a high resistance to discharge any static electricity that may be adhering to their clothing. the resistance value should be around 1 m ? ? and no other person should come between the person being discharged and ground (gnd). (3) when transporting semiconductor devices and pcbs, try to keep mechanical vibration and shocks to an absolute minimum. hkt100***u/hkt100y01u rev.1.01 feb 23, 2007 page 12 of 13 2. soldering 2.1 smd diodes are formed in consideration of pcb mount ability, and can be mounted without modification. (1) when mounting on pcb, adhesive is used to temporarily hold diodes in place before solder is applied. when as smd diodes is held by adhesive, be sure that it is not subjected to undue stress. (2) using a mounter to fix smd diodes to a pcb can result in bending of the leads, and diode package destroy, so make sure that a force of no more than 3 n is applied and al so required to not apply any force on the leads as being mounted, especially for flat package. (3) when mounting diodes to circuit board, so make sure that flatten on the pcb. (not becoming rough by wiring under diode body.) (4) please superfluous power does not join a product by the curvature of a circuit board or bending by circuit board bread etc. (5) since smd diodes come in small package, be aware of ther mal stress from soldering as small as possible. keep to the following conditions. ? when flow soldering: 260 c max. for 10 s ? when using a soldering iron: 350 c max. for 3 s (6) the material of lead is exposed for cutting plane. theref ore, soldering nature of lead tip part is considered as unquestioned. please kindly consider soldering nature. (7) when the smd is mounted through reflow soldering, avoid incorrect positioning and floating-type failures due to bad mounting balance by taking care on the following points. ? the left and right land patterns must have the same shape. ? the left and right land areas, including the wiring sections, must take up the same area and include the same amount of solder. ? the land position should become symmetrical. ? heat must be applied to both soldering sections at the same time (the direction shown in follow is recommended). reflow direction product substrate soldering conditions using reflow soldering method lead plating sn-pb / au / sn-bi solder paste sn-pb eutectic / sn-ag system package surface temperature (upper limit) peak temperature: 260 c 220 c or greater for 60 s or less temperature profile time reflow cycle: 2 times max. (4) (3) (2) (6) (7) (1) (5) package surface temperature (1) 110 30 s (5) 220 c 60 s max (2) 160 c (6) 255 c 16 s max (3) 190 c (7) 260 c max (4) 1 to 4 c/s hkt100***u/hkt100y01u rev.1.01 feb 23, 2007 page 13 of 13 3. cleaning 3.1 fading of the marking and color codes clearness of marking and color-fastness of color codes may be lost due to cleaning. be sure to check these after using cleaning agents. 3.2 electrical and mechanical characteristics (discoloration, deformation, denaturation, etc.) after cleaning a pcb, some corrosive material contained in the cleaning agent or flux may remain on semiconductor devices, causing corrosion of device wiring and leads with resulting loss of reliability. thorough cleaning is therefore required for pcbs. it is recommended that level of purity of the pcb after cleaning should conform with the mil standard below. pcb level of purity after cleaning item standard remaining cl volume 1 g/cm 2 resistance of solvent (after extraction) 2 10 6 ? .cm notes: 1. pcb surface area: both sides of the pcb + mounted components. 2. extract solvent: isopropyl alcohol (75 vol%) + h 2 o (25 vol%) (resistance of solvent before extraction is 6 10 6 ? .cm) 3. extraction method: clean both sides of pcb with 10 ml / 2.54 2.54 cm 2 (minimum of 1 min.) 4. measuring extracted solvent resistance: conductivity meter see mil-p-28809a for details of the mil standard. 3.3 ultrasonic cleaning it should be avoid resonation of the devices to prevent the device being destroyed. ? smd frequency: 28 to 29 khz (device should not be resonated) ultrasonic power output: 15 w/1 (1 time) time: up to 30 s others: make sure that neither devices not pcb come into contact with the vibration source. note: to ensure prompt handling of customer queries, the following information should be provided concerning the diode product used; (1) product name (int.c) (2) lot no. (lot) (3) weekly code (w/c) items (1), (2) and (3) above are printed on the label attached to the packing case, reel, etc. notes: 1. this document is provided for reference purposes only so that renesas customers may select the appropriate renesas product s for their use. renesas neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of renesas or any third party with respect to the information in this document. 2. renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of t he use of any information in this document, including, but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples. 3. you should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass destruction or for the purpose of any other military use. when exporting the products or technology described herein, you should follow the applicable export control laws and regulations, and procedures required by such laws and regulations. 4. all information included in this document such as product data, diagrams, charts, programs, algorithms, and application ci rcuit examples, is current as of the date this document is issued. such information, however, is subject to change without any prior notice. before purchasing or using any renesas products listed in this document, please confirm the latest product information with a renesas sales office. also, please pay regular and careful attentio n to additional and different information to be disclosed by renesas such as that disclosed through our website. (http://www.renesas.com ) 5. renesas has used reasonable care in compiling the information included in this document, but renesas assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information included in this document. 6. when using or otherwise relying on the information in this document, you should evaluate the information in light of the t otal system before deciding about the applicability of such information to the intended application. renesas makes no representations, warranties or guaranties regarding th e suitability of its products for any particular application and specifically disclaims any liability arising out of the application and use of the information in this do cument or renesas products. 7. with the exception of products specified by renesas as suitable for automobile applications, renesas products are not desi gned, manufactured or tested for applications or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of h uman injury or which require especially high quality and reliability such as safety systems, or equipment or systems for transportation and traffic, healthcare, combustion co ntrol, aerospace and aeronautics, nuclear power, or undersea communication transmission. if you are considering the use of our products for such purposes, please contact a r enesas sales office beforehand. renesas shall have no liability for damages arising out of the uses set forth above. 8. notwithstanding the preceding paragraph, you should not use renesas products for the purposes listed below: (1) artificial life support devices or systems (2) surgical implantations (3) healthcare intervention (e.g., excision, administration of medication, etc.) (4) any other purposes that pose a direct threat to human life renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to us e renesas products in any of the foregoing applications shall indemnify and hold harmless renesas technology corp., its affiliated companies and their officers, dir ectors, and employees against any and all damages arising out of such applications. 9. you should use the products described herein within the range specified by renesas, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. renesas sha ll have no liability for malfunctions or damages arising out of the use of renesas products beyond such specified ranges. 10. although renesas endeavors to improve the quality and reliability of its products, ic products have specific characteristic s such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. please be sure to implement safety measures to guard against the poss ibility of physical injury, and injury or damage caused by fire in the event of the failure of a renesas product, such as safety design for hardware and software includin g but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. among others, sinc e the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 11. in case renesas products listed in this document are detached from the products to which the renesas products are attached or affixed, the risk of accident such as swallowing by infants and small children is very high. you should implement safety measures so that renesas products may not be easily detached from your products. renesas shall have no liability for damages arising out of such detachment. 12. this document may not be reproduced or duplicated, in any form, in whole or in part, without prior written approval from r enesas. 13. please contact a renesas sales office if you have any questions regarding the information contained in this document, renes as semiconductor products, or if you have any other inquiries. sales strategic planning div. nippon bldg., 2-6-2, ohte-machi, chiyoda-ku, tokyo 100-0004, japan http://www.renesas.com refer to " http://www.renesas.com/en/network " for the latest and detailed information. renesas technology america, inc. 450 holger way, san jose, ca 95134-1368, u.s.a tel: <1> (408) 382-7500, fax: <1> (408) 382-7501 renesas technology europe limited dukes meadow, millboard road, bourne end, buckinghamshire, sl8 5fh, u.k. tel: <44> (1628) 585-100, fax: <44> (1628) 585-900 renesas technology (shanghai) co., ltd. unit 204, 205, aziacenter, no.1233 lujiazui ring rd, pudong district, shanghai, china 200120 tel: <86> (21) 5877-1818, fax: <86> (21) 6887-7898 renesas technology hong kong ltd. 7th floor, north tower, world finance centre, harbour city, 1 canton road, tsimshatsui, kowloon, hong kong tel: <852> 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